Amaoe BGA Reballing Stencil FOR Qualcomm PM660 670 845 MT6358W 6356W 6355W 6357V 6370P Magt PMIC Chip BGA IC Reballing Tin

Amaoe BGA Reballing Stencil FOR Qualcomm PM660 670 845 MT6358W 6356W 6355W 6357V 6370P Magt PMIC Chip BGA IC Reballing Tin

kr51.74 kr42.43
På lager
w69676

Type: Andre
Brug: Kommerciel Fremstilling
Materiale: Rustfrit Stål
Tykkelse: 0,12 mm
Model-Nummer: Amaoe BGA Reballing Stencil

  • Produkt Introduktion:

    Amaoe BGA Reballing Stencil FOR Qualcomm PM660 670 845 MT6358W 6356W 6355W 6357V 6370P Magt PMIC Chip BGA IC Reballing Tin

    Package:

    1 x Rebaling Stencil Skabelon

    Tags: amaoe telefon, amao stencil, stencil skabelon pm660, colophane flux, pmi632 902, mt6357 power ic, samsung stencil, ir-station, fluke scopemeter, rework station.

  • Anmeldelser (1)

    • Brunoreque0

      super rápido

    Skriv en anmeldelse

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